JPH064577Y2 - Ｉｃパッケージ - Google Patents

Ｉｃパッケージ

Info

Publication number
JPH064577Y2
JPH064577Y2 JP1987141052U JP14105287U JPH064577Y2 JP H064577 Y2 JPH064577 Y2 JP H064577Y2 JP 1987141052 U JP1987141052 U JP 1987141052U JP 14105287 U JP14105287 U JP 14105287U JP H064577 Y2 JPH064577 Y2 JP H064577Y2
Authority
JP
Japan
Prior art keywords
die
package
terminal chip
stage
convex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987141052U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6447037U (en]
Inventor
清英 福井
力 増子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1987141052U priority Critical patent/JPH064577Y2/ja
Publication of JPS6447037U publication Critical patent/JPS6447037U/ja
Application granted granted Critical
Publication of JPH064577Y2 publication Critical patent/JPH064577Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987141052U 1987-09-16 1987-09-16 Ｉｃパッケージ Expired - Lifetime JPH064577Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987141052U JPH064577Y2 (ja) 1987-09-16 1987-09-16 Ｉｃパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987141052U JPH064577Y2 (ja) 1987-09-16 1987-09-16 Ｉｃパッケージ

Publications (2)

Publication Number Publication Date
JPS6447037U JPS6447037U (en]) 1989-03-23
JPH064577Y2 true JPH064577Y2 (ja) 1994-02-02

Family

ID=31405779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987141052U Expired - Lifetime JPH064577Y2 (ja) 1987-09-16 1987-09-16 Ｉｃパッケージ

Country Status (1)

Country Link
JP (1) JPH064577Y2 (en])

Also Published As

Publication number Publication date
JPS6447037U (en]) 1989-03-23

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